May 22nd 2025 When designing photonic integrated circuits (PICs), it is tempting to focus purely on internal optical performance. However, a successful PIC design must also consider how the chip will be connected to the outside world. In this second part of PHIX’s...
This PIXAPP commercial prototype package involved the assembly of a silicon photonics integrated circuit (PIC) onto an electronic printed circuit board that has an integrated thermo-electric cooler (TEC) mounted below it. For ease of assembly, the optical fiber array...
CoPackaging of Terabit direct-detection and coherent Optical Engines and switching circuits in mulTI-Chip moduleS for Datacenter networks and the 5G optical fronthaul Announcement of Project Launch POETICS was officially kicked off on January 14-15, 2020 at the...
Looking forward – a few words from CEO Albert Hasper Prototype Package including Spot Size Converter (SSC ) Fiber Arrays with mode field 4.2 x 3.2 µm @ 1550nm, assembled to InP chip Dear All, It has only been a little more than one year when PHIX started its...
Project Launch – Kick-off meeting The implementation of TERAWAY project was officially inaugurated with the kick-off meeting that took place on 3rd and 4th of December 2019. All the twelve (12) members of the consortium were gathered for a two-day productive meeting...
TEEM Photonics glass Waveguide Array to Fiber Transposer (WAFT) allows users to make an efficient coupling from small mode field diameter Photonic Integrated Circuits (PIC) to Single Mode fibers using its proprietary glass ion exchange technology. Combined with the...
