Prototype packages

PHIX has developed several packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with electrical connections, optical interfaces, and thermal management. Hybrid assembly of auxiliary chips is also supported.

Characterization package for photonic IC

We encourage the choice for a standard housing. Each of these have characteristics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you.

More details about the differences between our standard package types can be found in this table (new window).

Download our Design Guidelines (.pdf)

To help you optimize your PIC design for low-cost and low-risk packaging and select the most suitable standardized package type, we offer you our PHIX Design Guidelines document as a free download.

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Optical interfacing (West)
Optical interfacing (East)
Electrical interfacing (North)
Electrical interfacing (South)
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“I did extensive market research to find a packaging foundry for my active hybrid integrated photonic device prototype and PHIX turned out to be the most reliable partner” – Andrey Voloshin (EPFL)