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Our offering

PHIX Photonics Assembly offers photonic packaging solutions based on customer-specific needs. Our services range from providing single manufacturing steps to complete joint development with manufacturing scale-up depending on the needs of our customers.

Together with our engineering team and partnerships we provide solutions on a global scale, offering a one-stop shop for your packaging requirements.

Custom Fiber Arrays

PHIX manufactures high performance standard and custom v-groove fiber arrays with sub-micron fiber spacing accuracy and uniform fiber core center line. Our PM type v-groove fiber array has a very precise axis alignment and high extinction ratio, while our multi-mode fiber array can be made with a variety of fibers including non-fluorescent, UV fibers, and Mid-IR fibers.

We have a suite of standard fiber arrays available from stock.

Fiber array with Spot Size Converter

In order to efficiently couple light from Photonic Integrated Circuits (PICs) with small mode field diameters, one needs to taper down the light in order to efficiently couple it to a glass fiber. PHIX offers Spot Size Converters (SSC) that are pre-terminated on a fiber array. This way a direct connection can be made to your PIC without the requirement to keep it at a specific focus distance in front of your chip. This reduces the required alignment degrees of freedom and ensures quick and repeatable interfacing.

CPS Prototype Package

PHIX has developed a plug and play solution that allows for flexible, quick and easy prototyping of your first chips without needing to develop an expensive customized package. The Characterization Package Standard (CPS) comes with some design rules in order to be able to perform the wire bonding and fiber attachment in a straight-forward way. Hybrid integrated PICs and fiber arrays of up to 40 fibers can also be accommodated by this package standard.

Custom Package development

If you want to introduce your product into a specific market, we are there to help you with our custom design competencies. We have a broad experience in existing markets like telecommunication packaging, but as well have a proven track record for sensor assemblies for use in industrial, automotive, medical, space and military operations. By collaborating in an early stage of the product development, we can make sure that your product meets the requirements throughout its life cycle.

 

Contract Manufacturing

If you want to outsource your assembly process or you’re looking for a secondary supplier to your own manufacturing, we are your trusted partner and scale up with your growth. Our engineering team can validate what is required for a safe launch transfer and decide together how to release our packaging foundry for your product.

We’re happy to support you by performing dedicated steps of your production on our equipment. Here we offer services for die bonding, wire bonding, hybrid assembly, fiber attachment, testing, etc.

Engineering Services

If you need a partner for your design and require feedback for your packaging, we’re there to support you. We support our customers from an early stage in the design process, starting at the chip design level. Our experts use their manufacturing knowledge to ensure that the entire product is developed with manufacturability as one of the key priorities.

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