PHIX offers photonics packaging solutions, ranging from single manufacturing steps to complete joint development with manufacturing scale-up.
We have many v-groove optical fiber arrays available from stock and can make custom configurations for you, using our dedicated machine.
We offer assembly services for all major PIC technology platforms and are specialized in hybrid integration of chip-to-chip and fiber-to-chip modules.
Learn all about our latest manufacturing solutions, products, collaborations and investments.
HOW WE PHIX IT
To integrate PICs into devices, they need to be connected to components like optical fibers, amplifiers and electronics with great accuracy. This packaging of our customers’ PICs, either as an outsourced packaging service or as contract manufacturing production process, is PHIX’s core competence, in which we aim to become world leader.
- We scale up with your production, from prototypes to large series
- We support and combine many material platforms, such as Silicon, Indium Phosphide, Silicon Nitride, Lithium Niobate, Gallium Arsenide and Ion exchanged glass
- We are your one-stop-shop, by helping you to optimally route your PIC with manufacturability and scale-up in mind
- We have a unique process for multi-chip hybrid interfacing using edge coupling
- We are European based and protect your intellectual property
- We have partnerships with key players in the photonics industry
- We have fiber arrays available for shipment directly from stock
If you want to outsource your assembly process or you’re looking for a secondary supplier to your own manufacturing, we are your trusted partner and scale up with your growth. We can support you by performing dedicated steps of your production on our equipment. We offer services for die bonding, wire bonding, hybrid assembly, fiber attachment, testing, and more.
Fiber Arrays from stock
PHIX offers a broad range of high quality v–groove optical fiber arrays for photonic integrated circuit (PIC) connections. We have a dedicated and flexible fiber placement machine and can attach an optional spot size converter. We have many fiber arrays available from stock and can make custom configurations for you.
CPS Prototype Package
PHIX has developed a plug and play solution that allows for flexible, quick and easy prototyping of your first chips without the need to develop an expensive customized package. The Characterization Package Standard (CPS) comes with some design rules in order to be able to perform the wire bonding and fiber array attachment in a straight-forward way.
Assembly and volume production can only take place when PICs are interfaced correctly into qualified modules. That’s why chip design is critical. Our qualified engineers advise you on how to design your PIC in such a way that it can be assembled and produced in scalable volumes.
Photonic chips need to be interfaced with other components, such as fiber arrays, free space and electronics, before they can find their way into your product. If your PIC is in the prototype phase, our Characterization Package Standard (CPS) is an easy and affordable way to test your technology quickly. When your chip is ready for volume production, we provide custom-tailored packaging services, using our wide experience in various markets.