PHIX offers photonics packaging solutions, ranging from single manufacturing steps to complete joint development with manufacturing scale-up.
We have many v-groove optical fiber arrays available from stock and can make custom configurations for you, using our dedicated machine.
We offer assembly services for all major PIC technology platforms and are specialized in hybrid integration of chip-to-chip and fiber-to-chip modules.
Learn all about our latest manufacturing solutions, products, collaborations and investments.
HOW WE PHIX IT
To integrate PICs into devices, they need to be connected to components like optical fibers, amplifiers and electronics with great accuracy. This packaging of our customers’ PICs, either as an outsourced packaging service or as contract manufacturing production process, is PHIX’s world leading core competence.
- We scale up with your production, from prototypes to large series
- We support and combine many material platforms, such as Silicon, Indium Phosphide, Silicon Nitride, Lithium Niobate, Gallium Arsenide and Ion exchanged glass
- We are your one-stop-shop, by helping you to optimally route your PIC with manufacturability and scale-up in mind
- We have a unique process for multi-chip hybrid interfacing using edge coupling
- We are European based and protect your intellectual property
- We have partnerships with key players in the photonics industry
- We have fiber arrays available for shipment directly from stock
If you want to outsource your assembly process or you’re looking for a secondary supplier to your own manufacturing, we are your trusted partner and scale up with your growth. We can support you by performing dedicated steps of your production on our equipment. We offer services for die bonding, wire bonding, hybrid assembly, fiber attachment, testing, and more.
PHIX provides packaging solutions that allow for convenient, quick and affordable prototyping of your first PIC-enabled modules. We have standard package types for various chip dimensions and system configurations. If you have special requirements, we are happy to design a customized prototype package for you.
PHIX has a broad experience in designing and assembling PIC-enabled modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as SiPh, InP, SiN and PLC, and can scale up our production to the volumes your product requires.
Assembly and volume production can only take place when PICs are interfaced correctly into qualified modules. That’s why chip design is critical. Our qualified engineers advise you on how to design your PIC in such a way that it can be assembled and produced in scalable volumes.
Photonic chips need to be interfaced with other components, such as fiber arrays, free space and electronics, before they can find their way into your product. If your PIC-based module is in the prototype phase, our Prototype Packages are an easy and affordable way to test your technology quickly. When your chip is ready for volume production, we provide Volume Packaging services, using our wide experience in various markets.