Packaging foundry for photonic ICs

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Our offering

PHIX offers photonics packaging solutions, ranging from single manufacturing steps to complete joint development with manufacturing scale-up.

Fiber arrays

We have many v-groove optical fiber arrays available from stock and can make custom configurations for you, using our dedicated machine.

About us

We offer assembly services for all major PIC technology platforms and are specialized in hybrid integration of chip-to-chip and fiber-to-chip modules.

Latest news

Learn all about our latest manufacturing solutions, products, collaborations and investments.

WHAT WE DO

Manufacturing photonic chip based components and modules in scalable production volumes.

PHIX provides an assembly and packaging service for photonic integrated circuits (PICs). We support chip prototypes as well as high-volume manufacturing and our engineers help optimize your design early on. We are a one-stop shop fully tailored to your needs. That’s how we prepare your products for tomorrow’s society, today.

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HOW WE PHIX IT

To integrate PICs into devices, they need to be connected to components like optical fibers, amplifiers and electronics with great accuracy. This packaging of our customers’ PICs, either as an outsourced packaging service or as contract manufacturing production process, is PHIX’s world leading core competence.

  • We scale up with your production, from prototypes to large series
  • We support and combine many material platforms, such as Silicon, Indium Phosphide, Silicon Nitride, Lithium Niobate, Gallium Arsenide and Ion exchanged glass
  • We are your one-stop-shop, by helping you to optimally route your PIC with manufacturability and scale-up in mind
  • We have a unique process for multi-chip hybrid interfacing using edge coupling
  • We are European based and protect your intellectual property
  • We have partnerships with key players in the photonics industry
  • We have fiber arrays available for shipment directly from stock

Integrating PICs and electronics in one single package. Assembled in volumes. That's PHIX.

Integrating PICs and electronics in one single package. Assembled in volumes. That's PHIX.

Integrating PICs and electronics in one single package. Assembled in volumes. That's PHIX.

PIC hybrid assembly on automated machine

Contract Manufacturing

If you want to outsource your assembly process or you’re looking for a secondary supplier to your own manufacturing, we are your trusted partner and scale up with your growth. We can support you by performing dedicated steps of your production on our equipment. We offer services for die bonding, wire bonding, hybrid assembly, fiber attachment, testing, and more.

chip characterization package

Prototype Package

PHIX provides packaging solutions that allow for convenient, quick and affordable prototyping of your first PIC-enabled modules. We have standard package types for various chip dimensions and system configurations. If you have special requirements, we are happy to design a customized prototype package for you.

butterfly PIC package produced in volume

Volume Package

PHIX has a broad experience in designing and assembling PIC-enabled modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as SiPh, InP, SiN and PLC, and can scale up our production to the volumes your product requires.

PHIX CEO Albert Hasper welcomes you to 2024

PHIX CEO Albert Hasper reflects on 2023 and looks ahead into 2024 2023 was a year in which our integrated photonics industry accelerated further. Many of our customers were scaling up their volumes from single digits towards prototype series ready to be scaled up. The...

Meet PHIX in the United States

November 27th, 2023 As an extension to PHIX's participation in The Netherlands and Flanders Mission to the United States, our CCO Jeroen Duis is traveling to several innovation hotspots in the US. He is available for in-person meetings to share PHIX's world leading...

PHIX Characterization Package added to Luceda IPKISS ADK

November 6th 2023 Luceda Photonics has launched an Assembly Design Kit (ADK) for the PHIX Characterization Package. This ADK is now available in their IPKISS design software for photonic integrated circuits.The implementation of this PHIX ADK in the Luceda Photonics...

PIC Design

Assembly and volume production can only take place when PICs are interfaced correctly into qualified modules. That’s why chip design is critical. Our qualified engineers advise you on how to design your PIC in such a way that it can be assembled and produced in scalable volumes.

PIC Packaging

Photonic chips need to be interfaced with other components, such as fiber arrays, free space and electronics, before they can find their way into your product. If your PIC-based module is in the prototype phase, our Prototype Packages are an easy and affordable way to test your technology quickly. When your chip is ready for volume production, we provide Volume Packaging services, using our wide experience in various markets.

I would like to know more about PHIX

If you have any enquiries about how we can work together, please get in touch using the contact form below.

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