ABOUT US

Company overview

PHIX is located at the High Tech Factory in Enschede, the Netherlands. We offer assembly services for all major photonic integrated circuit (PIC) technology platforms (like Indium Phosphide, Silicon Photonics, Silicon Nitride, and Planar Lightwave Circuit) and are specialized in hybrid integration of chip-to-chip and fiber-to-chip modules. PHIX provides a one-stop-shop for PIC assembly, from design to volume production.

We offer a state-of-the-art infrastructure in The Netherlands, supporting the global industrial development of PIC-enabled modules.

What is integrated photonics packaging?

Photonic integrated circuits (PICs) are chips in which photons are the carriers of data and energy. Compared to electronic integrated circuits (ICs), they can provide further miniaturization, higher processing speeds and lower power consumption. Also known as ASPICs, for application-specific photonic integrated circuits, these photonic chips have applications in countless areas. Examples are LIDAR systems in self-driving vehicles, medical scanners and quantum processors, to name just a few.

Even though PICs can house a lot of functionality on a small surface, a PIC by itself is not a functional product yet. To make it become a part of a photonics-enabled module, it needs to be connected to components like optical fibers, other PICs, cooling solutions, and electronics. The design and manufacturing of the package in which these connections are made is the core business of PHIX.

PHIX is the photonic equivalent of an OSAT (Outsourced Semiconductor Assembly and Test) company. In the electronics industry, the word ‘packaging’ often refers to the placement of the bare semiconductor die into a small protective enclosure. The resulting component is still called an IC. The packaging of a photonic IC, by contrast, also involves thermal management and the connection of optical fibers and electronics. It is a micro-assembly process that results in a PIC-enabled module that has both optical and electrical inputs and outputs.

PIC package within a larger product

A photonic quantum processor chip packaged into a functional module.
Photo courtesy of QuiX BV.

Our core competencies

Going from a PIC to a functional module is a multi-disciplinary design process. It involves product design (of the chip and the module), assembly process development, and equipment management. Our engineering and management teams contain people from each of these backgrounds. This gives us the overview and maturity to optimize the product’s performance and cost while keeping the countless parameters within these disciplines in mind.

Our knowledge and experience in the fields of optics, electronics, and mechanical engineering allows us to produce working prototypes already from the first chips. We can then proceed to optimize the PIC and module design, process and equipment, in order to scale up the production of the modules to high volumes.

Combining our broad industry overview with our engineering manpower and world-wide network of suppliers, we are ready to prepare and adapt the manufacturing of your PIC-enabled modules.

PHIX core competences

Management team

Albert Hasper portrait

Albert Hasper, Ph.D.

CEO PHIX Photonics Assembly

Albert Hasper is an operational and technical executive with 25+ years of experience in international high-tech business-to-business industry. For 7 years he was the Managing Director of the Amtech Solar Companies. In 2011 he was appointed General Manager of Tempress Systems B.V. Before that he was the VP of Global Operations at ASM International. Prior to the VP role he served for more than 5 years as General Manager of ASM Europe and was responsible for the world-wide Vertical Furnace product line.

Albert holds an M.Sc. and Ph.D. Degree in Electrical Engineering from the University of Twente. He has authored and co-authored over 25 scientific papers in various scientific journals. He is an inventor of 13 issued US patents in the areas of CVD & ALD deposition and Capital Equipment.

Joost van Kerkhof CTO

Joost van Kerkhof, Ph.D.

COO PHIX Photonics Assembly

Joost van Kerkhof was appointed as Chief Operations Officer of LioniX International since the merger of LioniX, XiO Photonics, and SatraX into LioniX International in 2016. Prior to this merger, Joost had served as CEO of XiO Photonics since 2013. Joost has more than 20 years of experience in the micro-nano technology industry. Before joining XiO Photonics, Joost worked with Sensata Technologies (automotive sensors) as Director Business Integration. Before his role in business management, he held positions within Texas Instruments (which became Sensata Technologies in 2006) as Director R&D and Director Operations. In these positions he launched multiple new products in scalable volumes.

Joost holds a M.Sc as well as a Ph.D. Degree in Electrical Engineering, specialized in micro-nano technology and (bio)sensors.

Jeroen Duis portrait

Jeroen Duis

CCO PHIX Photonics Assembly

Jeroen Duis received his bachelor’s degree from the Technical University of Rijswijk in 2001. After his study he worked 16 years within TE Connectivity. Within the Fiber Optic Business Unit and corporate technology team he held several positions in engineering, research, technology scouting and management. During this time, he gained a broad experience in: laser processing of glass fibers, WDM multiplexing, low loss optical interconnects, next generation photonic chip packaging for applications in mobile phones, automotive and high speed computing applications. In March 2017 he accepted a position at SMART Photonics, a scale up in Indium Phosphide wafer manufacturing where he was responsible for the business development. November 2018, Jeroen accepted a position as Chief Commercial Officer at PHIX Photonics Assembly where he is responsible for the commercial activities and the strategic direction for the hybrid packaging.  He is the author and co-author of several publications and holds 15 patent applications in the field of optical interconnection technology.

PHIX provides a one-stop-shop – from design to volume production – for PIC-enabled modules