Jeroen Duis appointed new CCO

We are proud to announce that Jeroen Duis joins the team of PHIX as of November 22nd. Jeroen will join PHIX in the position of Chief Commercial Officer and completes with his addition our Management Team. Jeroen (39) has worked his whole career in the photonics starting at the MTS Ede followed by the University of Rijswijk studying applied Physics with specialty in Optics. After this he joined Tyco International (later on TE Connectivity [TEL]) where he worked in several roles as development engineer, application engineer, technology incubator and engineering manager in a global organization. After 16 years of experience in the technical fiber optics field and 15 patents later in fiber assembly and chip packaging, he joined SMART Photonics as business developer. Here he gained a broader business acumen around integrated photonics in sales and marketing. With his complete background, he is widely recognized as industry professional and has been elected to participate in the organization of the 2019 Optical Networking and Communication Conference (OFC) as technical program member.

We welcome Jeroen joining the Board of PHIX and wish him success in his new role.

PHIX Photonics Assembly secures next round of financing and LioniX International obtains a majority share.

PHIX Photonics assembly (PHIX) moves forward in the next step of its growth due to the recent acquisition of LioniX International BV by Magic Micro Co. Ltd (https://photonics.lionix-international.com/wp-content/uploads/2018/07/Press-release-LioniX-international-Magic-Micro.pdf). As part of this acquisition and the further implementation plan towards high volume assembly of Photonic Integrated Circuit (PIC)  modules, LioniX International has increased its share in PHIX. This will strengthen its position as a vertical integrated supplier of PIC based modules.

PHIX and Tyndall Institute strengthen their collaboration

PHIX Photonics assembly (PHIX) and PIXAPP Pilot Line Coordinator Tyndall Institute have strengthened their collaboration in the development of the photonic packaging ecosystem by arranging dedicated training of PHIX engineers on Tyndall’s advanced packaging equipment. This sharing of knowledge will strengthen the photonic ecosystem in Europe and assure open access to high volume Photonic Integrated Circuit (PIC) packaging through the PIXAPP Pilot Line.

PHIX raises first round of investment

PHIX Photonics Assembly established its assembly and packaging production line in April 2017, targeting cost-effective fabrication of Photonic Integrated Circuit modules in large volumes. With its operations at the High Tech Factory, PHIX contributes to the established regional eco-system of design, engineering and development of integrated photonics solutions.