NEWS
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SENKO and PHIX advance European photonics packaging with a serviceable optical interface for multi-chip modules
September 17th 2026 SENKO Advanced Components and PHIX Photonics Assembly today announced a collaborative solution framework that establishes a common optical interface for photonic multi-chip modules, supporting precision assembly, package-level testing, final system...
Advancing photonic terahertz wireless communication toward real-world systems
June 3rd 2026 The TERA6G project has made breakthrough developments toward a deployable “fiber-over-the-air” telecom solution that combines integrated photonics, radio frequency (RF) electronics, and terahertz (THz) antenna arrays. With PHIX as an advanced packaging...
In The Spotlight: Chunting Zhong
March 23rd 2026 From an engineer to a technical sales representative: Chunting Zhong talks about the power of perseverance and finding a way to achieve her goals.The year has only just begun but the first item on Chunting’s annual wish list has already been ticked...
PHIX provides three webinars on photonics packaging
February 11th 2026 In a series of three ePIXfab webinars, PHIX product manager Andrea Alippi will provide an in-depth overview of integrated photonics packaging. He will cover topics like standardization, building blocks, design for manufacturability, core processes,...
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