Design for Packaging is an important part of photonic integrated circuit (PIC) design, because taking manufacturing constraints into account early on can significantly increase performance, reduce cost, and shorten lead time of the optoelectronic device. Assembly Design Kits (ADKs) within PIC design software can make design for packaging much easier. In this free webinar, PHIX […]
Symposium about (photonic) quantum computing, with contributions from industry (QuiX Quantum and PHIX) and academia (Saxion University of Applied Sciences and the University of Twente). The event is organized by KIVI Applied Physics and study association WATT, in collaboration with Quantum Delta NL. PHIX COO Joost van Kerkhof will give a presentation entitled "Photonics packaging […]
The EPIC Meeting on Integrated Photonics at Fraunhofer IZM brings together industry leaders, experts in photonics, and end-users from around the globe in the dynamic realm of integrated photonics. Hosted by the prestigious Fraunhofer Institute for Reliability and Microintegration (IZM), this meeting aims to foster collaborative discussions and explore the frontiers of integrated photonics technology […]
The ECOC Exhibition is a key meeting place for the fiber optic communication technology industry, attracting over 6,500 decision makers. In 2024, the event takes place at the Messe Frankfurt, in Germany from 23-25 September. You can meet the PHIX photonics packaging experts at the exhibition.