Volume packages

Assembling your PICs into functional modules in scalable volumes is PHIX’s core expertise. We have a broad experience in designing and assembling modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as Silicon Photonics, SiN, InP and PLC, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module.

tunable laser manufactured in volumes

If possible, we would like to start collaborating with you at an early stage of your PIC design. The early involvement of our experts can be crucial for the optimal performance, cost and manufacturability of your module, in small batches and in high volumes. 

Specify your volume package