Volume packages
Assembling your PICs into functional modules in scalable volumes is PHIX’s core expertise. We have a broad experience in designing and assembling modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as Silicon Photonics, SiN, InP and PLC, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module.
If possible, we would like to start collaborating with you at an early stage of your PIC design. The early involvement of our experts can be crucial for the optimal performance, cost and manufacturability of your module, in small batches and in high volumes.
PHIX Butterfly package
Our butterfly package is well-suited for a compact and well-sealed integrated photonics enabled device with a modest number of inputs and outputs. If your module needs many channels of optical I/O and/or RF electronics, our Large Area Goldbox may be a better choice.
Large Area Goldbox
This sturdy Goldbox package is great for housing your PIC-enabled module as part of a larger system. Although it only has one facet for optical I/O, up to 64 fibers can be used. The opposite facet is dedicated to up to 8 channels of high performance RF electrical interfacing.
Custom package
If you have specific needs that do not fit our standard packages, we can make modifications to them or even design a custom package for you. We have designed custom solutions for many markets and our engineers are ready to support your technology.
Contract manufacturing
If you already have a housing for your package, PHIX can help you with your volume assembly by the outsourcing or second-sourcing of your production. We can optimize your designs for maximum manufacturability and scale-up flexibility and can develop the processes needed for the production of your modules.
