
Volume packages
Assembling your PICs into functional modules in scalable volumes is PHIX’s core expertise. We have a broad experience in designing and assembling modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as Silicon Photonics, SiN, InP and PLC, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module.

If possible, we would like to start collaborating with you at an early stage of your PIC design. The early involvement of our experts can be crucial for the optimal performance, cost and manufacturability of your module, in small batches and in high volumes.
PHIX Butterfly package
Large Area Goldbox
Custom package
Contract manufacturing
If you already have a housing for your package, PHIX can help you with your volume assembly by the outsourcing or second-sourcing of your production. We can optimize your designs for maximum manufacturability and scale-up flexibility and can develop the processes needed for the production of your modules.