Standard package types
As part of our photonics packaging service, PHIX offers several standard package types that are suitable for chip characterization and optoelectronic module manufacturing in low to medium production volumes. Each of these have characteristics that favor certain chip dimensions and system configurations.
Besides the selection of housings listed below, PHIX can support many other industry standard packages, such as standard 14-pin butterflies and LCP overmolded lead frames. And if you have special requirements, we are happy to design a customized package for you. Have a look at our prototype and volume packaging offering.
* Actual maximum fiber count depends on many factors and can be higher or lower. A mechanical fit check is always performed to verify a given design.
CS = Customer-specified
Ext. = External
Int. = Internal
N/A = Not Applicable
-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Fiber coupling scheme
Spot size converter option
Hermeticity options
Optional electrical fan-out
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor location
PHIX Characterization Package
Sample characterization
Initial custom proof-of-concept, photonic device learning cycle
2 x 32
Edge coupling, quasi-planar grating coupling
Yes
No
Yes, DC fan-out board included
CS, typically 31 x 16 x 6.6 mm
CS, typically 39.5 x 47 x 14.6 mm
CS, typically 107.5 x 47 x 14.6 mm
0-2 x optical (east/west), 0-2 x electrical (north/south)
2 x 60
60-pin FFC connector or DC fan-out board
typically 200 µm +/- 50 µm
200 mA
N/A or custom
N/A
N/A
N/A
N/A
Yes, optional PHIX Cooling Carrier
Copper block
-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Fiber coupling scheme
Spot size converter option
Hermeticity options
Optional electrical fan-out
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor location
PIXAPP Characterization Package
Sample characterization
Initial proof-of-concept using OTS PIXAPP design
2 x 48
Edge coupling, quasi-planar grating coupling, low-profile vertical grating coupling
Limited by mechanical fit
No
No
39 x 30 x 12 mm
100 x 66 x 23 mm
100 x 66 x 23 mm
1-2 x optical (east/west), 1x electrical (north)
22
Ribbon cable
0.3 mm int. / 0.635 mm ext.
3.4 A
N/A
N/A
N/A
N/A
N/A
Yes
Baseplate, chip, PCB
-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Fiber coupling scheme
Spot size converter option
Hermeticity options
Optional electrical fan-out
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor location
PHIX Butterfly
Device prototype / Small to medium-scale production
Micro-ITLA, optical transmitter/receiver
12
Edge coupling, quasi-planar grating coupling
Limited by mechanical fit
Semi-hermetic
No
24.5 x 8.2 x 6.4 mm
26.5 x 12.8 x 7.4 mm
40 x 54.6 x 7.4 mm
2 x electrical (north/south), 1 x optical (west)
2 x 26
Au-plated elevated pins
0.4 mm int. / 0.85 mm ext.
1 A
N/A
N/A
N/A
N/A
N/A
Low-profile
TEC cold plate, chip, patterned submount
-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Fiber coupling scheme
Spot size converter option
Hermeticity options
Optional electrical fan-out
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor location
PHIX Butterfly XL
Low/medium speed device prototype / Small to medium-scale production
Directly modulated laser, low/medium speed photodiode
12
Edge coupling, quasi-planar grating coupling
Supported by most devices
Full / semi-hermetic
No
26.8 x 13.8 x 7.8 mm
38 x 21 x 9.3 mm
43.4 x 40 x 9.3 mm
2 x electrical (north/south), 1 x optical (west)
2 x 5 (2 x 7 if no RF)
Au-plated elevated pins
2.54 mm
1 A (two pads up to 3A)
2 x GSG
Au-plated surface-mount pins
2.54 mm
Up to 15 GHz
No
Low-profile
Case, TEC cold plate, chip, patterned submount
-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Fiber coupling scheme
Spot size converter option
Hermeticity options
Optional electrical fan-out
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor location
XLMD-MSA Butterfly
High-speed device prototype / Small to medium-scale production
Directly modulated laser, high-speed photodiode
4
Edge coupling, quasi-planar grating coupling
Limited by mechanical fit
Semi-hermetic
No
13 x 6.5 x 7.7 mm
21.9 x 22 x 8.5 mm
21.9 x 32 x 8.5 mm
3 x electrical (north/south/east), 1 x optical (west)
2 x 7
Au-plated elevated pins
1.27 mm (1/20 in.)
1 A
2
SMPM connectors
0.3 mm
Up to 40 GHz
No
Low-profile
TEC cold plate, chip, patterned submount
-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Fiber coupling scheme
Spot size converter option
Hermeticity options
Optional electrical fan-out
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor location
Large Area Gold Box
Device prototype / Small to medium-scale production
Multi-chip photonic system module
64
Edge coupling, quasi-planar grating coupling
Supported by most devices
Full / semi-hermetic
Yes, 64 GHz RF fan-out
44.8 x 21 x 5.5 mm
50 x 27 x 6.5 mm
57.5 x 39.5 x 6.5 mm
3 x electrical (north/south/east), 1 x optical (west)
2 x 25
Au-plated surface-mount pins
1 mm
1 A
8 x GSG or 4 x GSSG
Au-plated surface-mount pins
2 mm between even/odd, 5 mm between pairs (GSG), 4 mm (GSSG)
Up to 64 GHz
No
Low-profile
Case, TEC cold plate, chip, patterned submount/fanout
Download our Design Guidelines (.pdf)
To help you optimize your PIC design for low-cost and low-risk packaging and select the most suitable standardized package type, we offer you our PHIX Design Guidelines document as a free download.