Standard package types
PHIX offers several standard package types that are suitable for chip characterization and optoelectronic module manufacturing in low to medium production volumes. Each of these have characteristics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you.
* Actual maximum fiber count depends on many factors and can be higher or lower. A mechanical fit check is always performed to verify a given design.
CS = Customer-specified
Ext. = External
Int. = Internal
N/A = Not Applicable
PHIX Characterization Package
-- General --
Appearance
Solution domain
Sample characterization
Example applications
Initial custom proof-of-concept, photonic device learning cycle
Max. fiber count*
2 x 48
Fiber coupling scheme
Edge coupling, quasi-planar grating coupling, low-profile vertical grating coupling
Spot size converter option
Yes
Optional electrical fan-out
Yes, DC to header connector
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
CS, typically 31 x 16 x 6.6 mm
Bulk ext. dimensions (w/o pins)
CS, typically 39.5 x 47 x 14.6 mm
Envelope ext. dimensions (w/ pins and ports)
CS, typically 107.5 x 47 x 14.6 mm
Edge allocations
1-2 x optical (east/west), 1-2 x electrical (north/south)
-- DC Electrical --
DC connections
CS, typically 2 x 51
DC ext. interface
CS, typically ribbon cable
DC connection pitch
CS, typically 0.5 mm
DC max. current/pin
CS, typically 1 A
-- RF Electrical --
RF connections
CS
RF ext. interface
CS, typically SMA
RF connection pitch
CS
RF bandwidth
CS
RF termination
CS
-- Thermal --
Peltier TEC
Yes
Thermistor
Cu block, TEC cold plate, chip, patterned submount/fanout
PIXAPP Characterization Package
-- General --
Appearance
Solution domain
Sample characterization
Example applications
Initial proof-of-concept using OTS PIXAPP design
Max. fiber count*
2 x 48
Fiber coupling scheme
Edge coupling, quasi-planar grating coupling, low-profile vertical grating coupling
Spot size converter option
Limited by mechanical fit
Optional electrical fan-out
No
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
39 x 30 x 12 mm
Bulk ext. dimensions (w/o pins)
100 x 66 x 23 mm
Envelope ext. dimensions (w/ pins and ports)
100 x 66 x 23 mm
Edge allocations
1-2 x optical (east/west), 1x electrical (north)
-- DC Electrical --
DC connections
22
DC ext. interface
Ribbon cable
DC connection pitch
0.3 mm int. / 0.635 mm ext.
DC max. current/pin
3.4 A
-- RF Electrical --
RF connections
N/A
RF ext. interface
N/A
RF connection pitch
N/A
RF bandwidth
N/A
RF termination
N/A
-- Thermal --
Peltier TEC
Yes
Thermistor
Baseplate, chip, PCB
PHIX Butterfly
-- General --
Appearance
Solution domain
Device prototype / Small to medium-scale production
Example applications
Micro-ITLA, optical transmitter/receiver
Max. fiber count*
12
Fiber coupling scheme
Edge coupling, quasi-planar grating coupling
Spot size converter option
Limited by mechanical fit
Optional electrical fan-out
No
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
24.5 x 8.2 x 6.4 mm
Bulk ext. dimensions (w/o pins)
26.5 x 12.8 x 7.4 mm
Envelope ext. dimensions (w/ pins and ports)
40 x 54.6 x 7.4 mm
Edge allocations
2 x electrical (north/south), 1 x optical (west)
-- DC Electrical --
DC connections
2 x 26
DC ext. interface
Au-plated elevated pins
DC connection pitch
0.4 mm int. / 0.85 mm ext.
DC max. current/pin
1 A
-- RF Electrical --
RF connections
N/A
RF ext. interface
N/A
RF connection pitch
N/A
RF bandwidth
N/A
RF termination
N/A
-- Thermal --
Peltier TEC
Low-profile
Thermistor
TEC cold plate, chip, patterned submount
XLMD-MSA Butterfly
-- General --
Appearance
Solution domain
High-speed device prototype / Small to medium-scale production
Example applications
Directly modulated laser, high-speed photodiode
Max. fiber count*
4
Fiber coupling scheme
Edge coupling, quasi-planar grating coupling
Spot size converter option
Limited by mechanical fit
Optional electrical fan-out
No
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
13 x 6.5 x 7.7 mm
Bulk ext. dimensions (w/o pins)
21.9 x 22 x 8.5 mm
Envelope ext. dimensions (w/ pins and ports)
21.9 x 32 x 8.5 mm
Edge allocations
3 x electrical (north/south/east), 1 x optical (west)
-- DC Electrical --
DC connections
2 x 7
DC ext. interface
Au-plated elevated pins
DC connection pitch
1.27 mm (1/20 in.)
DC max. current/pin
1 A
-- RF Electrical --
RF connections
2
RF ext. interface
SMPM connectors
RF connection pitch
0.3 mm
RF bandwidth
Up to 40 GHz
RF termination
No
-- Thermal --
Peltier TEC
Low-profile
Thermistor
TEC cold plate, chip, patterned submount
Large Area Gold Box
-- General --
Appearance
Solution domain
Device prototype / Small to medium-scale production
Example applications
Multi-chip photonic system module
Max. fiber count*
64
Fiber coupling scheme
Edge coupling, quasi-planar grating coupling
Spot size converter option
Supported by most devices
Optional electrical fan-out
Yes, 64 GHz RF fan-out
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
44.8 x 21 x 5.5 mm
Bulk ext. dimensions (w/o pins)
50 x 27 x 6.5 mm
Envelope ext. dimensions (w/ pins and ports)
57.5 x 39.5 x 6.5 mm
Edge allocations
3 x electrical (north/south/east), 1 x optical (west)
-- DC Electrical --
DC connections
2 x 25
DC ext. interface
Au-plated surface-mount pins
DC connection pitch
1 mm
DC max. current/pin
1 A
-- RF Electrical --
RF connections
8 x GSG or 4 x GSSG
RF ext. interface
Au-plated surface-mount pins
RF connection pitch
2 mm between even/odd, 5 mm between pairs (GSG), 4 mm (GSSG)
RF bandwidth
Up to 64 GHz
RF termination
No
-- Thermal --
Peltier TEC
Low-profile
Thermistor
Case, TEC cold plate, chip, patterned submount/fanout