
Standard package types
PHIX offers several standard package types that are suitable for chip characterization and optoelectronic module manufacturing in low to medium production volumes. Each of these have characteristics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you.
* Actual maximum fiber count depends on many factors and can be higher or lower. A mechanical fit check is always performed to verify a given design.
CS = Customer-specified
Ext. = External
Int. = Internal
N/A = Not Applicable
PHIX Characterization Package
-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Spot size converter
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor
PIXAPP Characterization Package
-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Spot size converter
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor
PHIX Butterfly
-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Spot size converter
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor
Large Area Gold Box
-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Spot size converter
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor
Download our Design Guidelines
To help you optimize your PIC design for low-cost and low-risk packaging and select the most suitable standardized package type, we offer you our PHIX Design Guidelines document as a free download.