Standard package types

As part of our photonics packaging service, PHIX offers several standard package types that are suitable for chip characterization and optoelectronic module manufacturing in low, medium, and high production volumes. Each of these have characteristics that favor certain chip dimensions and system configurations.

Besides the selection of housings listed below, PHIX can support many other industry standard or customer-specific packages. If you have special requirements, we can even design a customized package for you. You can make custom enquiries on our prototype and volume packaging pages.

 

* Actual maximum fiber count depends on many factors and can be higher or lower. A mechanical fit check is always performed to verify a given design.
CS = Customer-specified
Ext. = External
Int. = Internal
N/A = Not Applicable

Characterization packages

-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Fiber coupling scheme
Spot size converter option
Hermeticity options
Optional electrical fan-out
Documentation
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor location
PHIX Characterization Package
Sample characterization
Initial custom proof-of-concept, photonic device learning cycle
2 x 32
Edge coupling, quasi-planar grating coupling
Yes
No
Yes, DC fan-out board included
CS, typically 31 x 16 x 6.6 mm
CS, typically 39.5 x 47 x 14.6 mm
CS, typically 107.5 x 47 x 14.6 mm
0-2 x optical (east/west), 0-2 x electrical (north/south)
2 x 60
60-pin FFC connector or DC fan-out board
typically 200 µm +/- 50 µm
200 mA
N/A or custom
N/A
N/A
N/A
N/A
Yes, optional PHIX Cooling Carrier
Copper block
PIXAPP Characterization Package
Sample characterization
Initial proof-of-concept using OTS PIXAPP design
2 x 48
Edge coupling, quasi-planar grating coupling, low-profile vertical grating coupling
Limited by mechanical fit
No
No
100 x 66 x 23 mm
100 x 66 x 23 mm
1-2 x optical (east/west), 1x electrical (north)
Ribbon cable
0.3 mm int. / 0.635 mm ext.
3.4 A
N/A
N/A
N/A
N/A
Baseplate, chip, PCB

Butterfly packages

-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Fiber coupling scheme
Spot size converter option
Hermeticity options
Optional electrical fan-out
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor location
14-pin Butterfly
Low/medium speed device prototype / Low to high volume production
Hybrid tunable laser
8
Edge coupling, quasi-planar grating coupling
Limited by mechanical fit
Full / semi-hermetic
No
18.8 x 7 x 6.3 mm
37.4 x 12.7 x 7.8 mm
37.4 x 43.3 x 7.8 mm
2 x electrical (north/south), 1x optical (west)
2 x 5 (2 x 7 if no TEC & NTC)
Au-plated elevated pins
2.54 mm
1 A
N/A
N/A
N/A
N/A
N/A
Yes, included
TEC cold plate, chip, patterned submount
Dual optical 14-pin Butterfly
Device prototype / Low to high volume production
Directly modulated laser, inline amplifier
2 x 8
Edge coupling, quasi-planar grating coupling
Limited by mechanical fit
Full / semi-hermetic
No
25 x 7.1 x 6.3 mm
39 x 15.1 x 7.8 mm
39 x 43.5 x 7.8 mm
2 x electrical (north/south), 2x optical (east/west)
2 x 5 (2 x 7 if no TEC & NTC)
Au-plated elevated pins
2.54 mm
1 A
N/A
N/A
N/A
N/A
N/A
Low-profile
TEC cold plate, chip, patterned submount
PHIX Butterfly
Device prototype / Low to high volume production
Micro-ITLA, optical transmitter/receiver
12
Edge coupling, quasi-planar grating coupling
Limited by mechanical fit
Semi-hermetic
No
24.5 x 8.2 x 6.4 mm
26.5 x 12.8 x 7.4 mm
40 x 54.6 x 7.4 mm
2 x electrical (north/south), 1 x optical (west)
2 x 24 (2 x 26 if no TEC & NTC)
Au-plated elevated pins
0.4 mm int. / 0.85 mm ext.
1 A
N/A
N/A
N/A
N/A
N/A
Low-profile
TEC cold plate, chip, patterned submount
PHIX Butterfly XL
Low/medium speed device prototype / Low to high volume production
Directly modulated laser, low/medium speed photodiode
12
Edge coupling, quasi-planar grating coupling
Supported by most devices
Full / semi-hermetic
No
26.8 x 13.8 x 7.8 mm
38 x 21 x 9.3 mm
43.4 x 40 x 9.3 mm
2 x electrical (north/south), 1 x optical (west)
2 x 5 (2 x 7 if no RF)
Au-plated elevated pins
2.54 mm
1 A (two pads up to 3A)
2 x GSG
Au-plated surface-mount pins
2.54 mm
Up to 15 GHz
No
Low-profile
Case, TEC cold plate, chip, patterned submount
XLMD-MSA Butterfly
High-speed device prototype / Low to high volume production
Directly modulated laser, high-speed photodiode
4
Edge coupling, quasi-planar grating coupling
Limited by mechanical fit
Semi-hermetic
No
13 x 6.5 x 7.7 mm
21.9 x 22 x 8.5 mm
21.9 x 32 x 8.5 mm
3 x electrical (north/south/east), 1 x optical (west)
2 x 5 (2 x 7 if no TEC & NTC)
Au-plated elevated pins
1.27 mm (1/20 in.)
1 A
2
SMPM connectors
0.3 mm
Up to 40 GHz
No
Low-profile
TEC cold plate, chip, patterned submount

Other packages

-- General --
Appearance
Solution domain
Example applications
Max. fiber count*
Fiber coupling scheme
Spot size converter option
Hermeticity options
Optional electrical fan-out
-- Mechanical --
Internal dimensions (L x W x H)
Bulk ext. dimensions (w/o pins)
Envelope ext. dimensions (w/ pins and ports)
Edge allocations
-- DC Electrical --
DC connections
DC ext. interface
DC connection pitch
DC max. current/pin
-- RF Electrical --
RF connections
RF ext. interface
RF connection pitch
RF bandwidth
RF termination
-- Thermal --
Peltier TEC
Thermistor location
Large Area Gold Box
Device prototype / Low to high volume production
Multi-chip photonic system module
8 (32 if not fully hermetic)
Edge coupling, quasi-planar grating coupling
Supported by most devices
Full / semi-hermetic
Yes, 64 GHz RF fan-out
44.8 x 21 x 5.5 mm
50 x 27 x 6.5 mm
57.5 x 39.5 x 6.5 mm
3 x electrical (north/south/east), 1 x optical (west)
2 x 20 (2 x 25 if no TEC & NTC)
Au-plated surface-mount pins
1 mm
1 A
8 x GSG or 4 x GSSG
Au-plated surface-mount pins
2 mm between even/odd, 5 mm between pairs (GSG), 4 mm (GSSG)
Up to 64 GHz
No
Low-profile
Case, TEC cold plate, chip, patterned submount/fanout
Extra Large Area Goldbox
Device prototype / Low to high volume production
Multi-chip photonic system module
8 (32 if not fully hermetic)
Edge coupling, quasi-planar grating coupling
Supported by most devices
Full / semi-hermetic
No
60 x 32.4 x 10 mm
73 x 35.4 x 12 mm
73 x 51.4 x 12 mm
2 x electrical (north/south), 1 x optical (west)
2 x 30 (2 x 35 if no TEC & NTC)
Au-plated elevated pins
1 mm
1 A
N/A
N/A
N/A
N/A
N/A
Yes
Case, TEC cold plate, chip, patterned submount/fanout
LCP Overmolded Leadframe
Medium to high volume production
Multi-chip photonic system module
32
Edge coupling, quasi-planar grating coupling
Supported by most devices
Full / semi-hermetic
No
40.1 x 25.7 x 7.0 mm
46.0 x 30.8 x 9.4 mm
57.3 x 51.4 x 9.4 mm
2 x electrical (north/south), 1 x optical (west)
Customizable
Au-plated elevated pins
Customizable
1 A
Customizable
Au-plated elevated pins
Customizable
Up to 60 GHz
No
Low-profile
TEC cold plate, chip, patterned submount

Download our Design Guidelines (.pdf)

To help you optimize your PIC design for low-cost and low-risk packaging and select the most suitable standardized package type, we offer you our PHIX Design Guidelines document as a free download.

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