Our partnerships

PHIX cooperates with main players in the photonics industry to strengthen its position in the competitive photonics field. Our partnerships support our position in the market and enable us to work with SME’s developing their bright ideas up to well-known multinationals. Next to this the European project collaborations support our roadmap and develop the base technologies that we can introduce to the market and enables new applications.

In the PIXAPP consortium, led by Ireland’s Tyndall National Institute. The aim of PIXAPP is to develop generic packaging solutions in the marketplace in order to drive down the price of the final product. As such, the market penetration of PICs is to be accelerated. PHIX supports the consortium by developing packaging standards to enable cost-effective PIC packaging and by participating in the  pilot line program to support new business development based on its own developed technologies.

Twente has a long history in fine mechanical assembly and automation due to Philips that has been building its lighting components here. The area therefore has excellent competencies in building new fine assembly machinery and a top ranked university with supporting technical research facility. The collaboration with Fraunhofer IPT therefore delivered the first automated fiber array assembly machine to our factory.

LioniX International supplies modules enabled by Photonic Integrated Circuits (PIC) based on its proprietary waveguide technology (TriPleX™). PHIX spun out from LioniX International in 2017 to perform the scale up of the hybrid integration technology developed by them to build hybrid laser structures in high volumes. This allowed LioniX to become a vertically integrated company with scalable production volumes.

Synopsys has been the launching partner for our Packaging Design Kit. The broad adoption of the Synopsys software enables customers to consider not only the optical requirements of the chips, but also supports by providing guidance on electrical pad sizes and locations as well as guidance on optical / electrical splitting of your chip to allow for the standard chip packaging platform usage lowering the initial prototyping cost, reducing the development time and allows for manufacturing scale up.