Prototype packages
We encourage the choice for a standard housing. Each of these have characteristics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you.
PHIX Characterization package
This package is constructed from off-the-shelf building blocks and offers a quick and affordable way to perform characterization of your first chips. It is suitable for large fiber arrays. The relatively spacious housing has a lot of room for customer-specific components. The placement of a TEC is also supported.
PIXAPP Characterization package
In this packaging configuration, your PIC is assembled onto an electronic PCB and an integrated thermoelectric cooler (TEC) is mounted directly below it. For the fiber array attachment, both grating and edge coupling is supported.
PHIX Butterfly package
Our butterfly package is well-suited for a compact photonics enabled device prototype with a modest number of inputs and outputs. If your module needs many channels of optical I/O and/or RF electronics, our CPS or Goldbox may be better choices.
Large Area Goldbox
This well-sealed and sturdy Goldbox package is great for housing your PIC-enabled module as part of a larger system prototype. Although it only has one facet for optical I/O, up to 64 fibers can be used. The opposite facet is dedicated to up to 8 channels of high performance RF electrical interfacing.
Custom package
If you have specific needs that do not fit our standard packages, we can make modifications to them or even design a custom package for you. We have designed custom solutions for many markets and our engineers are ready to support your technology.
Download our Package Type Specifications
To help you select the standardized package that is best suited to your PIC, we offer you our PHIX Package Type Specifications document as a free download.