Prototype packages

This package is constructed from off-the-shelf building blocks and offers a quick and affordable way to perform characterization of your first chips. It is suitable for large fiber arrays. The relatively spacious housing has a lot of room for customer-specific components. The placement of a TEC is also supported. More specifications can be found in our standard package types table.

In this packaging configuration, your PIC is assembled onto an electronic PCB and an integrated thermoelectric cooler (TEC) is mounted directly below it. For the fiber array attachment, both grating and edge coupling is supported. More specifications can be found in our standard package types table.

Our butterfly package is well-suited for a compact photonics enabled device prototype with a modest number of inputs and outputs. If your module needs many channels of optical I/O and/or RF electronics, our CPS or Goldbox may be better choices. More specifications can be found in our standard package types table.

Our XLMD-MSA butterfly package offers the most compact footprint. Although the number of available connections is limited due to its small size, the package provides two SMPM connectors for RF electrical signals. More specifications can be found in our standard package types table.

This well-sealed and sturdy Goldbox package is great for housing your PIC-enabled module as part of a larger system prototype. Although it only has one facet for optical I/O, up to 64 fibers can be used. The opposite facet is dedicated to up to 8 channels of high performance RF electrical interfacing. An optional fan-out PCB is available. More specifications can be found in our standard package types table.

If you have specific needs that do not fit our standard packages, we can make modifications to them or even design a custom package for you. We have designed custom solutions for many markets and our engineers are ready to support your technology.