
Prototype packages

We encourage the choice for a standard housing. Each of these have characteristics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you.
PHIX Characterization package
This package is constructed from off-the-shelf building blocks and offers a quick and affordable way to perform characterization of your first chips. It is suitable for large fiber arrays. The relatively spacious housing has a lot of room for customer-specific components. The placement of a TEC is also supported.
PIXAPP Characterization package
PHIX Butterfly package
Large Area Goldbox
This well-sealed and sturdy Goldbox package is great for housing your PIC-enabled module as part of a larger system prototype. Although it only has one facet for optical I/O, up to 64 fibers can be used. The opposite facet is dedicated to up to 8 channels of high performance RF electrical interfacing.
Custom package
Download our Package Type Specifications
To help you select the standardized package that is best suited to your PIC, we offer you our PHIX Package Type Specifications document as a free download.