November 27th, 2023 PHIX is participating in The Netherlands and Flanders Mission to the United States, taking place from December 3rd to 8th 2023 in Phoenix Arizona and San Francisco California. Our CCO Jeroen Duis is adding a second leg to this trip until December...
November 6th 2023 Luceda Photonics has launched an Assembly Design Kit (ADK) for the PHIX Characterization Package. This ADK is now available in their IPKISS design software for photonic integrated circuits.The implementation of this PHIX ADK in the Luceda Photonics...
September 28th, 2023 The PHIX Characterization Package has received a major update, increasing both its level of standardization and its flexibility as a development platform for photonic integrated circuits (PICs). The PHIX Characterization Package is an open...
In collaboration with Surfix Diagnostics, PHIX is pleased to offer you a white paper about the wafer level manufacturing of photonic biosensors with integrated active components. As part of this work, PHIX demonstrates flip chip integration of III-V photonic...
Eindhoven, The Netherlands, April 20th 2023 PHIX CEO Albert Hasper was honored to participate in a round table discussion with His Majesty King Willem-Alexander of The Netherlands at PhotonDelta in Eindhoven. The King learned about the strong integrated photonics...
February 16th 2023 Having already offered 3D printing of microlenses on fiber arrays and photonic integrated circuits (PICs) as part of a partnership with Nanoscribe, photonics packaging foundry PHIX is preparing to further industrialize this process by acquiring a...
September 19th 2022 The Horizon Europe project PATTERN will develop the world’s first Process and Assembly Design Kits (PDK & ADK) for microwave photonics at ultra‐high frequencies (100+ GHz) as well as new methods or heterogeneous integration of III-V gain...
PHIX is pleased to offer you a free white paper about spot size converters (SSCs). By improving the mode field matching, these optional extensions to our fiber arrays greatly reduce coupling losses between optical fibers and photonic integrated circuits. Our free...
Wire bonding is a common, but very important, process for connecting photonic integrated circuits (PICs) with their surrounding electronics. The recently acquired Royce Instruments 620 pull-shear tester allows PHIX to pinpoint weaknesses in the process and materials...