April 11th 2024 Our customer Light Trace Photonics is using a PHIX package as part of a programmable system for educating the photonics engineers of the future. Plug-and-play exploration of photonic chip technologyLight Trace Photonics is a Bristol (UK) based company...
Meet PHIX in the United States
November 27th, 2023 As an extension to PHIX's participation in The Netherlands and Flanders Mission to the United States, our CCO Jeroen Duis is traveling to several innovation hotspots in the US. He is available for in-person meetings to share PHIX's world leading...
PHIX Characterization Package added to Luceda IPKISS ADK
November 6th 2023 Luceda Photonics has launched an Assembly Design Kit (ADK) for the PHIX Characterization Package. This ADK is now available in their IPKISS design software for photonic integrated circuits.The implementation of this PHIX ADK in the Luceda Photonics...
PHIX updates Characterization Package development platform
September 28th, 2023 The PHIX Characterization Package has received a major update, increasing both its level of standardization and its flexibility as a development platform for photonic integrated circuits (PICs). The PHIX Characterization Package is an open...
White paper on wafer level manufacturing of photonic biosensors
In collaboration with Surfix Diagnostics, PHIX is pleased to offer you a white paper about the wafer level manufacturing of photonic biosensors with integrated active components. As part of this work, PHIX demonstrates flip chip integration of III-V photonic...
PHIX CEO Albert Hasper meets King of The Netherlands
Eindhoven, The Netherlands, April 20th 2023 PHIX CEO Albert Hasper was honored to participate in a round table discussion with His Majesty King Willem-Alexander of The Netherlands at PhotonDelta in Eindhoven. The King learned about the strong integrated photonics...
PHIX prepares for in-house 3D printing of microlenses
February 16th 2023 Having already offered 3D printing of microlenses on fiber arrays and photonic integrated circuits (PICs) as part of a partnership with Nanoscribe, photonics packaging foundry PHIX is preparing to further industrialize this process by acquiring a...
PHIX develops innovative packaging solutions for ultra-high speed hybrid PICs in PATTERN project
September 19th 2022 The Horizon Europe project PATTERN will develop the world’s first Process and Assembly Design Kits (PDK & ADK) for microwave photonics at ultra‐high frequencies (100+ GHz) as well as new methods or heterogeneous integration of III-V gain...
Read our white paper on spot size converters
PHIX is pleased to offer you a free white paper about spot size converters (SSCs). By improving the mode field matching, these optional extensions to our fiber arrays greatly reduce coupling losses between optical fibers and photonic integrated circuits. Our free...