News
Pull testing for wire bonding process optimization

Pull testing for wire bonding process optimization

Wire bonding is a common, but very important, process for connecting photonic integrated circuits (PICs) with their surrounding electronics. The recently acquired Royce Instruments 620 pull-shear tester allows PHIX to pinpoint weaknesses in the process and materials...

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PHIX launches silicon nitride spot size converters

PHIX launches silicon nitride spot size converters

PHIX introduces silicon nitride spot size converters for efficiently coupling light between fiber arrays and photonic integrated circuits. They complement our existing offering of IONext spot size converters and lensed fiber arrays.Silicon nitride (SiN) spot size...

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Qmode project with QuiX

Qmode project with QuiX

QuiX Quantum and PHIX started a collaboration in the project Qmode to overcome the packaging challenges of connecting large-scale quantum photonic processors to the outside world. Within the Qmode project, QuiX Quantum and PHIX work together to connect a large quantum...

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New fully automatic hybrid assembly machine

New fully automatic hybrid assembly machine

PHIX just unwrapped a brand new Finetech Fineplacer Femto 2 machine, a flexible fully automatic flip chip assembly workhorse that will further increase our manufacturing throughput. Furthermore, we are the first commercial company to obtain a customization within the...

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