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PHIX updates Characterization Package development platform

PHIX updates Characterization Package development platform

September 28th, 2023 The PHIX Characterization Package has received a major update, increasing both its level of standardization and its flexibility as a development platform for photonic integrated circuits (PICs).  The PHIX Characterization Package is an open...

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PHIX CEO Albert Hasper meets King of The Netherlands

PHIX CEO Albert Hasper meets King of The Netherlands

Eindhoven, The Netherlands, April 20th 2023 PHIX CEO Albert Hasper was honored to participate in a round table discussion with His Majesty King Willem-Alexander of The Netherlands at PhotonDelta in Eindhoven. The King learned about the strong integrated photonics...

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PHIX prepares for in-house 3D printing of microlenses

PHIX prepares for in-house 3D printing of microlenses

February 16th 2023 Having already offered 3D printing of microlenses on fiber arrays and photonic integrated circuits (PICs) as part of a partnership with Nanoscribe, photonics packaging foundry PHIX is preparing to further industrialize this process by acquiring a...

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Read our white paper on spot size converters

Read our white paper on spot size converters

PHIX is pleased to offer you a free white paper about spot size converters (SSCs). By improving the mode field matching, these optional extensions to our fiber arrays greatly reduce coupling losses between optical fibers and photonic integrated circuits. Our free...

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Pull testing for wire bonding process optimization

Pull testing for wire bonding process optimization

Wire bonding is a common, but very important, process for connecting photonic integrated circuits (PICs) with their surrounding electronics. The recently acquired Royce Instruments 620 pull-shear tester allows PHIX to pinpoint weaknesses in the process and materials...

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