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Design for Packaging Webinar with Luceda Photonics

May 7 @ 5:00 pm - 6:00 pm CEST

PHIX Characterization Package development platform

Design for Packaging is an important part of photonic integrated circuit (PIC) design, because taking manufacturing constraints into account early on can significantly increase performance, reduce cost, and shorten lead time of the optoelectronic device.

Assembly Design Kits (ADKs) within PIC design software can make design for packaging much easier. In this free webinar, PHIX Product Manager Andrea Alippi will introduce the PHIX Characterization Package platform and Luceda Photonics will demonstrate how their PHIX ADK makes design for this packaging type a breeze in their IPKISS software. The market focus is on applications for LiDAR and datacom.

Register now to learn more about Design for Packaging and see a live demonstration of the design of an optical phase array (OPA) and an IQ modulator, ready for assembly.

Note: there is a Chinese version of this webinar which takes place two hours earlier.


Luceda Photonics
+32 52 33 98 38
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