The EPIC Meeting on Integrated Photonics at Fraunhofer IZM brings together industry leaders, experts in photonics, and end-users from around the globe in the dynamic realm of integrated photonics. Hosted by the prestigious Fraunhofer Institute for Reliability and Microintegration (IZM), this meeting aims to foster collaborative discussions and explore the frontiers of integrated photonics technology and scalable packaging of photonic chips.
In the session about “Photonics Packaging in Volume”, PHIX CCO Jeroen Duis will give a keynote lecture about “PIC Packaging Scale-up Challenges”.