PHIX develops innovative packaging solutions for ultra-high speed hybrid PICs in PATTERN project

September 19th 2022 

The Horizon Europe project PATTERN will develop the world’s first Process and Assembly Design Kits (PDK & ADK) for microwave photonics at ultra‐high frequencies (100+ GHz) as well as new methods or heterogeneous integration of III-V gain materials (e.g. InP) and BiCMOS drivers with electro-optic and nonlinear platforms such as lithium niobate on insulator (LNOI). It also envisions new and advanced PIC building blocks, such as acousto-optic modulators (AOMs) and magneto-optic insulators.  

PATTERN launched on September 1st 2022 and is a collaboration of ten renowned partners, among which are Thales, Luceda Photonics, Imec and Fraunhofer HHI. The project develops elaborate hybrid integration solutions for various existing and emerging PIC platforms. To achieve this goal, PATTERN proposes a massive hybrid / heterogenous integration campaign between InP and LNOI platforms through methods such as butt-coupling, flip-chip bonding and micro-transfer printing. In addition, it introduces new materials such as yttrium iron garnet (YIG) to add magneto-optic functionalities to PICs. PATTERN will also develop solutions for the co‐integration of electronic silicon germanium (SiGe) chips with PICs, which is a necessity especially at ultra‐high speeds.

The role of PHIX within PATTERN is to provide innovative packaging solutions for such high frequencies, and to  assemble prototypes demonstrating the capabilities of this PIC platform for six applications. 

PATTERN project microwave photonics

Characterization of experimental photonic integrated circuits (PICs). Photo courtsey of CSEM.

Previous