PHIX RF Characterization Package Design Rules

To enable cost-effective packaging with short lead times for the PHIX RF Characterization Package, we offer a design rules document to assist you during the PIC design and layouting phase. The document covers PIC size and plaform compatibility, optical and electrical connectivity, fiducial markings, RF configuration, and much more. Conformity with these design rules allows PHIX to make use of standardized (and automated) production processes and off-the-shelf building blocks. The design rules build on the PIC Design Guidelines document, which describes good design practices for all package types. We highly recommend that you download and study both documents.