14-pin Butterfly Package
The 14-pin Butterfly Package is a compact industry standard housing for optoelectronic modules, with options for hermetic sealing. It provides a fiber feed-through, electrical fan-out, and built-in thermal management for photonic integrated circuits (PICs). PHIX provides design guidelines that promote standardization and accelerate module design, enabling reduced packaging costs and lead times.
Key features
- PICs of various sizes and several material platforms are supported.
- Edge or grating coupled SM or PM fiber array of up to 8 channels.
- 14 pins of DC connections.
- Integrated thermoelectric cooler (TEC) and thermistor for thermal control.
- Options for full or semi-hermetic sealing.
- Suitable for MIL-STD-883 and Telcordia quality standards
Photographed product provided by Chilas
Design guidelines documentation
To enable cost-effective packaging with short lead times for the 14-pin Butterfly Package, PHIX offers design guidelines for your chip and its surrounding architecture. We also supply a STEP-file that indicates the available design area within the housing. Conformity with these guidelines allows PHIX to make use of standardized (and automated) production processes and off-the-shelf building blocks. The design guidelines for the 14-pin Butterfly Package build on the PIC Design Guidelines document that describes good design practices for all package types. We highly recommend that you download and study both documents.
Download our 14-pin Butterfly Design Guidelines (.pdf)
To help you optimize your PIC design for low-cost, low-risk, and scalable packaging inside a 14-pin Butterfly housing, we offer you our PHIX 14-pin Butterfly Package Design Guidelines document as a free download.
Other package types
If you suspect that other packages types may be a better fit for your project, please review our standard package types table.

