February 11th 2026
In a series of three ePIXfab webinars, PHIX product manager Andrea Alippi will provide an in-depth overview of integrated photonics packaging. He will cover topics like standardization, building blocks, design for manufacturability, core processes, and equipment. The webinars can be attended for free.
These ePIXfab webinars are organized in association with the photonixFAB project, in line with its mission to provide a path to scalable high-volume manufacturing for innovative product developers in Europe.
Please note that each of the three webinars requires its own registration.
Dates and topics
February 12th 2026
14:00-15:30 CET
Webinar 1: Introduction to PHIX & Foundational Photonic Packaging Design
An introduction to PHIX and industrial-scale photonics assembly. We cover photonics packaging fundamentals, including key design rules and the principles of design for manufacturability. You will learn how early design choices influence yield, performance, and cost, and will gain practical insights into best practices that ensure smooth transition from prototype to scalable production.
April 2nd 2026
14:00 – 15:30 CET
Webinar 2: Photonic Assembly Processes: From Die Preparation to Optical Interfaces
This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. The webinar also addresses the assembly of fiber arrays and spot size converters, creation of robust optical interfaces, and approaches to thermal management.
April 14th 2026
14:00 – 15:30 CET
Webinar 3: Advanced Packaging: Electrical Interconnects, High-Power Optics & Space Applications
The final webinar focuses on advanced packaging challenges and solutions. Topics include establishing reliable electrical connections, integrating high-power optical interfaces, and techniques for free space optical coupling. We conclude with design considerations for space-grade photonic systems, addressing environmental constraints and reliability requirements. This session is ideal for designers working on demanding applications requiring high performance and long-term stability.
Ready to get started with packaging your PIC-based innovation?
