PHIX Characterization Package Support

Here you will find support resources for our PHIX Characterization Package for photonic integrated circuits.

Quick Start Guide

In this video our process engineer David van Duinen shows you how to unpack, handle, and connect your PHIX Characterization Package. He covers topics such as basic module layout, connectivity, thermal management, and safe handling. The video is also a good first introduction to this integrated photonics packaging platform.

Please note that this video refers to an older version of the PHIX Characterization Package and may not be entirely up to date.

Frequently Asked Questions (FAQ)

front page of document design guidelines for photonic integrated circuit packaging

Design Guidelines for PIC Packaging

This document describes the core design guidelines for photonic integrated circuits (PICs) that will enable PHIX to package your chip into a high performance and cost-effective module that is suitable for a scale-up to volume manufacturing. It will also help you select the standard package type that best suits your needs.

Newsletter opt-in

I have a different question