Here you will find some support resources for our products and services related to integrated photonics packaging.

front page of document design guidelines for photonic integrated circuit packaging

Design Guidelines for PIC Packaging

This document describes the core design guidelines for photonic integrated circuits (PICs) that will enable PHIX to package your chip into a high performance and cost-effective module that is suitable for a scale-up to volume manufacturing. It will also help you select the standard package type that best suits your needs.

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chip characterization package

Support for PHIX Characterization Package

This support page contains a Quick Start Guide video about our PHIX Characterization Package.

Lensed fiber array

Support for Lensed Fiber Arrays

Lensed fiber arrays (LFAs) are very fragile due to the protruding microfabricated lenses on the edge of the lid. Please consult our frequently asked questions on how to safely handle, store, and clean your LFAs.

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