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OIDA Technology Showcase
April 27 - April 29Free
OIDA member companies present and explain their cutting-edge technologies in areas such as fiber optics, metrology, lasers, precision optical components, and services. The company showcases and networking opportunities are free and open to the public.
PHIX will do a presentation on April 29th at 10:20 EDT (UTC -4) and will be available for networking afterwards.
Jeroen Duis will elaborate on the possibilities of PIC packaging from prototype to volume assembly, using PHIX’s state-of-the-art manufacturing tools for hybrid assembly. Hybrid assembly is seen as one of the most promising techniques to utilize the best of the chip material system without performance compromise. PHIX demonstrates a roadmap from prototype to high volume without having to develop your own packaging infrastructure, using established business models from the electronics industry.