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EPIC Online Technology Meeting on PIC Packaging
April 26 @ 3:00 pm - 5:00 pm CEST
In this meeting, we will have an update about new trends and considerations for packaging and testing of optical modules including passive/active optical alignment, wafer-level vs die level packaging and testing, thermal control, volume vs prize and new manufacturing needs in co-package optics. Key players in the packaging field will discuss about the adoption of standards, packaging requirements for new applications and development of large-volume manufacturing processes.
PHIX is a sponsor of the meeting and our CCO Jeroen Duis will gave a presentation.