IC packaging engineer (full-time)

PHIX is looking for a full-time integrated circuit packaging engineer to support our photonics and electronics assembly activities in Enschede, The Netherlands. 

Company profile

PHIX is a packaging foundry for photonic ICs (PICs) and we aim to become world leader in packaging and assembly of Photonic Integrated Circuits (PICs). We supply customized PIC based components and modules to OEM customers and system integrators in scalable production volumes.

We believe that early involvement is critical to come to the best results and therefore PHIX is also offering engineering support in the product design phase to ensure the manufacturability of the PIC based modules. PHIX is a scale-up company that started operations in 2018. 

Job description

In many of our projects we are asked to co-package photonic ICs with electronic ICs in 2.5D or 3D packaging configurations. For these projects we are looking for an experienced IC packaging engineer who is interested in the challenging world of photonic IC packaging. The IC packaging engineer will be responsible for the development of electronic and photonic co-packaging technology for our customer projects and internal roadmap projects.

Job responsibilities

• Act as project lead for customer projects and/or research projects
• Act as technical lead for electronic-photonic IC co-packaging technology
• Translate customer requirements into specific product and assembly process designs
• Carry out IC package development activities from design and simulation to qualification
• Resolve technical issues in the areas of packaging, process, and materials
• Optimize product designs in cooperation with product design engineers to optimize manufacturability.

Professional Requirements

• Minimum 5 years of experience in semiconductor packaging
• Detailed understanding of all major wafer, chip, and board-level packaging processes, including advanced packaging techniques such as 3D and 2.5D integration
• Strong IC packaging materials background including characterization and failure analysis
• Experience in applying Six Sigma in process development and process improvement
• Ideal candidate also has photonic IC packaging experience
• Practical and pragmatic approach
• Capable of working independently
• Good personal organization and good reporting and documentation skills
• Relevant BSc. or MSc. degree

Languages

• Fluency in English
• Dutch or willing to learn to speak Dutch

What we offer you

• A position in the new area of photonic IC packaging, a vibrant area with many exciting challenges and developments
• An opportunity to develop PHIX, together with us, into a market leader in an entrepreneurial, dynamic environment
• A talented and diverse group of passionate people working in an open culture.
• A challenging position with plenty of room for own initiatives and professional development.
• A competitive set of employment terms.

Are you interested?

Please send your motivation letter and resume to: Fraser Williamson (f.williamson@phix.com)

Acquisition as a result of this advertisement is not appreciated.